Base Station PCB and 5G Base Station Equipment PCB
Base station PCB is a high-frequency printed circuit board used to transmit data at 4.9GHz. It requires special laminates and materials that can handle the high-speed data transmission.
The new technology can help to reduce congestion and provide uninterrupted connectivity. This will lead to a large market demand for base station PCB.
Antenna
PCB antennas are used to transmit electric signals over long distances. They convert the electrical signals into electromagnetic waves. They can be either directional or semi-directional. The directional antennas send their signals in one direction while the semi-directional ones have a predetermined propagation angle. These antennas are designed to be compact and small in size, so they must be efficient. To maximize efficiency, multiple microstrip patches are integrated together. The size of the patches depends on the wavelength of the operating frequency.
The PCB antenna’s transmission line must also be designed with care. Bends and corners in the lines can cause signal losses. Impedance mismatches can also reduce the performance of an antenna. To avoid this, a lumped element matching network can be used. This can be tuned using series and shunt inductive or capacitive elements.
The 5G era is gradually approaching, which will bring about the mass construction and upgrading of communication base stations. This will provide a huge demand for high-frequency and high-speed PCB. The communication Base station PCB multilayer boards mainly include HDI and FPC.
Baseband Processing Unit (BBU)
The baseband processing unit is a component of the cellular communication network that converts radio frequency signals into data and vice versa. It is also responsible for the management of wireless connections, and it can be used in a variety of ways. For example, it can be found in professional two-way radio systems to dispatch fleets of trucks or taxicabs. It can also be used to activate one-way paging receivers.
The 5G era is approaching, and the construction of communication base stations will bring more incremental market space for PCBs. The millimeter wave technology of 5G will enable massive MIMO (large-scale antenna array) technology, promoting the scale of base station to break through 10 million level, and the demand for high-frequency and high-speed boards will increase dramatically.
With the increasing data consumption and connected devices, it is necessary to have fast and dependable connectivity. PCB manufacturers must refine existing processes and shift designs to meet new needs. This will help them stay competitive and adapt to new trends in the industry. It is important to use thermal-resistant materials and shift design techniques to reduce lagging performance and improve signal transmission.
Baseband Radio Frequency Interface Board (BRFI)
The baseband radio frequency interface board (BRFI) is a component used to transfer data over the air. It consists of an RF transceiver and a baseband signal processing core. The RF transceiver converts a clock signal into an RF data stream. The BBP then transfers this data with the interface core at its clock frequency. This method allows the BRFI to operate with an arbitrary clock frequency, which is essential in the telecommunications industry.
The BRFI also contains an identification interface that serves to identify the type of base station and mark the position of the current slot in the BB cassette. The main processing unit of the BBU uses input messages from this interface to determine the operation state of the BB cassette. It then takes appropriate action accordingly.
The communication base station equipment PCB market is highly competitive, with a number of key players competing for market share. High manufacturing costs and environmental concerns can hinder the growth of the market, but opportunities exist in the emergence of edge computing and the demand for small cell base stations. In addition, the emergence of 5G technology has made it necessary to develop new communications base stations that can handle massive traffic.
Power Board
The PCBs used in 5G base stations need to be able to withstand the high data rates and bandwidth demands of the new network. This demand is fueling the Base Station PCB Supplier expansion of the global Communication Base Station Equipment PCB Market.
These boards can be made with various thicknesses of copper, ranging from two-layer to multi-layer PCBs. The thicker layers are often referred to as heavy copper or HPC. The thickness of a copper layer can be expressed either in terms of its weight per area or as a percentage of the total board thickness. The former is more convenient for comparing different products.
The PCBs used in communication base stations typically contain holes or perforations that allow component leads to project through to the next interconnection layer. These holes help to reduce the distance between the component pins and the traces on the circuit board, thus improving signal integrity and increasing the frequency of signals. The holes also help to prevent differential thermal expansion, which could damage the traces or components and cause mechanical failure.
Surge Board
In order to deal with increasing data demand and connect devices, 5G will greatly accelerate the laying of base stations. This will further drive the demand for multilayer circuit boards. It will also promote the development of HDI and FPC.
The present base station protector assembly has particular application in being used to interconnect a base station router of the power distribution network and different kinds of consumers’ sensitive electrical equipment so as to protect such equipment from damage caused by transient voltage and current surges.
Base stations need to have high performance and reliability. It’s necessary to use multilayer PCBs to ensure this. The high frequency PCB CCL (Circuit Card Cladding, or CCL) used in a base station is usually made of hydrocarbon or polytetrafluoroethylene materials and then pressed together with ordinary FR4. It is mainly used for antennas and power amplifiers. It has a much larger size than 4G CCL, and can reach a diameter of 30mm or more. The conductive layer can be either copper or silver, and the insulation layer can be glass fiber, FR4, or PTFE.